Thin‐film formation

MAY 01, 1980

The advances made in the last few years are due to developments in four areas: increased demand, new analytic techniques, improved process monitors and controls, and detailed process modelling.

DOI: 10.1063/1.2914077

John L. Vossen

Werner Kern

The enormous number of successful applications of thin films for a large variety of scientific, engineering and industrial purposes is in large measure due to the rapidly increasing scientific understanding of the nature of the processes used to deposit thin films. Remarkable advances have been made, especially over the last decade, both in the understanding of older processes and in the development of new ones to satisfy new, and ever more sophisticated, needs. This special issue of PHYSICS TODAY includes representative articles on thin‐film processes, analytic techniques and applications.

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References

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More about the authors

John L. Vossen, RCA Laboratories, Princeton, New Jersey.

Werner Kern, RCA Laboratories, Princeton, New Jersey.