Thin‐film formation

MAY 01, 1980

The advances made in the last few years are due to developments in four areas: increased demand, new analytic techniques, improved process monitors and controls, and detailed process modelling.

DOI: 10.1063/1.2914077

John L. Vossen

Werner Kern

The enormous number of successful applications of thin films for a large variety of scientific, engineering and industrial purposes is in large measure due to the rapidly increasing scientific understanding of the nature of the processes used to deposit thin films. Remarkable advances have been made, especially over the last decade, both in the understanding of older processes and in the development of new ones to satisfy new, and ever more sophisticated, needs. This special issue of PHYSICS TODAY includes representative articles on thin‐film processes, analytic techniques and applications.

This article is only available in PDF format

References

1. J. L. Vossen, W. Kern, eds., Thin Film Processes, Academic, New York (1978).
2. L. I. Maissel, R. Glang, eds., Handbook of Thin Film Technology, McGraw‐Hill, New York (1970).
3. S. Dushman, J. M. Lafferty, Scientific Foundations of Vacuum Technology, 2nd edition, Wiley, New York (1962).
4. A. Y. Cho, J. R. Arthur, Prog. Solid State Chem. 10, 157 (1975).https://doi.org/PSSTAW
5. B. A. Joyce, Surf. Sci. 86, 92 (1979).https://doi.org/SUSCAS
6. L. L. Chang, L. Esaki, Prog. Crystal Growth 2, 3 (1979).
7. J. L. Vossen, J. Electrochem. Soc. 126, 319 (1979).https://doi.org/JESOAN
8. W. L. Grube, J. G. Gay, Metall. Trans. 9A, 1421 (1978).
9. J. F. O’Hanlon, in Oxides and Oxide Films, A. K. Vijh, ed., Volume 5, page 1, Dekker, New York (1977).
10. J. W. Coburn, H. F. Winters, J. Vac. Sci. Technol. 16, 391 (1979).https://doi.org/JVSTAL
11. T. O. Sedgewick, H. Lydtin, eds., Chemical Vapor Deposition 1979, Proc. Seventh Internatl. Conf., The Electrochemical Soc., Inc. Princeton, New Jersey (1979).
(See also previous volumes of this series published in 1970, 1972, 1973, 1975 and 1977).
12. R. S. Rosler, G. M. Engle, Solid State Technol. 22, (12) 88 (1979).
13. J. W. Matthews, ed., Epitaxial Growth, Parts A and B, Academic, New York (1975).
14. C. T. Powell, J. H. Oxley, J. M. Blocher, Jr., eds., Vapor Deposition, Wiley, New York (1966).
15. E. Yeager, A. J. Salking, Techniques of Electrochemistry, Volume 3, Wiley‐Interscience, New York (1978);
F. A. Lowenheim, ed., Modern Electroplating, 3rd ed., Wiley‐Interscience, New York (1974);
G. L. Schnable, P. F. Schmidt, J. Electrochem. Soc. 123, 310C (1976).
16. B. N. Chapman, J. C. Anderson, eds., Science and Technology of Surface Coating, Academic, London (1974).

More about the Authors

John L. Vossen. RCA Laboratories, Princeton, New Jersey.

Werner Kern. RCA Laboratories, Princeton, New Jersey.